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STPS30H60C
Power Schottky rectifier
Main product characteristics
IF(AV) VRRM Tj VF (typ) 2 X 15 A 60 V 175 C 0.535 V
A1 K A2
K A1 A2
Features and benefits

TO-220FPAB STPS30H60CFP
High junction temperature capability Avalanche rated Low leakage current Good trade-off between leakage current and forward voltage drop High frequency operation
A2 K A1 A1 K A2
TO-220AB STPS30H60CT
I2PAK STPS30H60CR
Description
Dual centre tab Schottky rectifier suited for high frequency switch mode power supply. Packaged in TO-220FPAB, TO-220AB, TO-247, I2PAK, and D2PAK, this device is intended to be used in notebook and LCD adaptors and desktop SMPS. In these applications the STPS30H60C provides a good margin between the remaining voltages applied on the diode and the voltage capability of the diode
K
A2 A1 K A1 A2
D2PAK STPS30H60CG
TO-247 STPS30H60CW
Order codes
Part Number STPS30H60CT STPS30H60CR STPS30H60CG-TR STPS30H60CG STPS30H60CW STPS30H60CFP Marking STPS30H60CT STPS30H60CR STPS30H60CG STPS30H60CG STPS30H60CW STPS30H60CFP
March 2007
Rev 2
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Characteristics
STPS30H60C
1
Table 1.
Symbol VRRM IF(RMS)
Characteristics
Absolute ratings (limiting values per diode)
Parameter Repetitive peak reverse voltage RMS forward current TO-220AB Tc = 155 C TO-220FPAB Tc = 135 C tp = 10 ms Sinusoidal Tj = 25 C tp = 1 s Per diode Total package Per diode Total package Value 60 30 15 30 15 30 230 10 200 -65 to + 175 temperature(1) 175 A W C C Unit V A A
IF(AV)
Average forward current, = 0.5
IFSM PARM Tstg Tj
1.
Surge non repetitive forward current Releative peak avalanche power Storage temperature range Maximum operating junction
dP tot 1 -------------- < ------------------------dT j R th ( j - a )
condition to avoid thermal runaway for a diode on its own heatsink
Table 2.
Symbol
Thermal parameters
Parameter TO-220AB, I2PAK, D2PAK, TO-247 Per diode Total Per diode Total Value 1.5 0.8 4.7 3.95 0.1 3.2 C/W Unit
Rth(j-c)
Junction to case TO-220FPAB
Rth(c)
Coupling
TO-220AB, I2PAK, D2PAK, TO-247 TO-220FPAB
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 7.5 A IF = 15 A IF = 30 A Min. Typ Max. 60 8 435 535 635 25 550 470 660 570 820 690 mV Unit A
mA
VF(2)
Forward voltage drop
1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2%
To evaluate the conduction losses use the following equation: P = 0.45 x IF(AV) + 0.008 x IF2(RMS)
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STPS30H60C
Characteristics
Figure 1.
Conduction losses versus average forward current
Figure 2.
Average forward current versus ambient temperature ( = 0.5, per diode)
PF(AV)(W)
12
=0.05 =0.1 =0.2 =0.5 =1
18 16
IF(AV)(A)
Rth(j-a)=Rth(j-c)
10
14
TO-220FPAB
8
12 10
6
8
Rth(j-a)=15 C/W
4
T
6 4 2
2
IF(AV)(A)
0 0 2 4 6 8 10 12
=tp/T
14 16
tp
Tamb(C)
0 25 50 75 100 125 150 175
0
18
Figure 3.
Normalized avalanche power derating versus pulse duration
Figure 4.
Normalized avalanche power derating versus junction temperature
PARM(tp) PARM(1s)
1.E+00
PARM(tp) PARM(25C)
1.2 1.0
1.E-01
0.8 0.6
1.E-02
0.4 0.2
tp(s)
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Tj(C)
0.0 25 50 75 100 125 150
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, TO-247 D2PAK, I2PAK)
Figure 6.
Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB)
TO-220FPAB
IM(A)
200 180
120
IM(A)
100
160 140 120 100 80 60 40 20 0 1.E-03
IM t =0.5
TC=50C
80
TC=50 C
60
TC=75C
TC=75 C
40
TC=125C
20
IM t =0.5
TC=125 C
t(s)
1.E-02 1.E-01 1.E+00
t(s)
1.E-02 1.E-01 1.E+00
0 1.E-03
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Characteristics
STPS30H60C
Figure 7.
Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, TO-247 D2PAK, I2PAK)
1.0 0.9 0.8
Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB)
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse =0.2 =0.1 =0.5
Zth(j-c)/Rth(j-c)
TO-220FPAB
0.7 0.6 0.5 0.4
T
=0.2 =0.1 =0.5
0.3 0.2
T
tp(s)
=tp/T
tp
0.1
Single pulse
tp(s)
1.E-01
=tp/T
1.E+00
tp
0.0 1.E-03 1.E-02 1.E+01
Figure 9.
Reverse leakage current versus reverse voltage applied (typical values, per diode)
Tj=150C
Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode)
C(nF)
10.0
F=1MHz Vosc=30mVRMS Tj=25C
IR(mA)
1.E+02
1.E+01
Tj=125C Tj=100C Tj=75C
1.E+00
1.0
1.E-01
Tj=50C
1.E-02
Tj=25C
1.E-03 0 5 10 15 20 25 30 35
VR(V)
40 45 50 55 60
VR(V)
0.1 1 10 100
Figure 11. Forward voltage drop versus forward current (per diode)
Figure 12. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, copper thickness = 35 m) (D2PAK)
Rth(j-a)(C/W)
80
100
IFM(A)
TJ=125 C Maximum values TJ=125 C Typical values TJ=25 C Maximum values
70 60 50 40 30 20 10
10
VFM(V)
1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
0 0 5 10 15
S(cm)
20 25 30 35 40
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STPS30H60C
Package mechanical data
2
Package mechanical data

Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm TO-220FPAB dimensions
Dimensions Ref. Millimeters Min. A
A H B
Table 4.
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4
4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10
B D E
Dia L6 L2 L3 L5 F1 L4 F2 D L7
F F1 F2 G G1 H L2
E
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1 G
L3 L4 L5 L6 L7 Dia.
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Package mechanical data Table 5. TO-220AB dimensions
STPS30H60C
Dimensions Ref Millimeters Min. A
H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40
4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10
C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam.
16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
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STPS30H60C Table 6. TO-247 dimensions
Package mechanical data
DIMENSIONS REF Millimeters Min. A
V
Inches Min. 0.191 0.086 0.015 0.039 0.118 0.078 Typ. Max. 0.203 0.102 0.031 0.055
Typ.
Max. 5.15 2.60 0.80 1.40
4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55
D E
V
Dia
F F1
H
A
F2 F3
2.40 3.40
0.078 0.118 0.429
0.094 0.133
L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1
F4 G H L L1 L2 L3 L4 L5 M V V2 Dia.
15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139
0.620 0.793 0.169
0.582
0.118
0.143
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Package mechanical data Table 7. I2PAK dimensions
STPS30H60C
DIMENSIONS REF. Millimeters Min.
A E L2 c2
Inches Min. Max.
Max.
A A1 b b1
4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27
4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40
0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050
0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055
D
c c2
L1 L b1
A1
D e e1 E
b e e1
c
L L1 L2
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STPS30H60C Table 8. D2PAK dimensions
Package mechanical data
DIMENSIONS REF. Millimeters Min. A
A E L2
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
A1
C2
A2 B
D
L L3 A1 B2 B G A2
B2 C C2
C R
D E G L
M
*
V2
L2 L3 M R V2
* FLAT ZONE NO LESS THAN 2mm
0.40 typ. 0 8
0.016 typ. 0 8
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30 1.30
5.08
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STPS30H60C
3
Ordering information
Part Number STPS30H60CT STPS30H60CR STPS30H60CG Marking STPS30H60CT STPS30H60CR STPS30H60CG Package TO-220AB I PAK D2PAK D PAK TO-247 TO-220FPAB
2 2
Weight 2.23 g 1.49 g 1.48 g 1.48 g 4.46 g 2.00 g
Base qty 50 50 50 1000 30 50
Delivery mode Tube Tube Tube Tape & reel Tube Tube
STPS30H60CG-TR STPS30H60CG-TR STPS30H60CW STPS30H60CFP STPS30H60W STPS30H60CFP
4
Revision history
Date 27-Feb-2006 31-Mar-2007 Revision 1 2 First issue Added TO-220FPAB package. Updated thermal parameters in Table 2. Description of Changes
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STPS30H60C
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